Bonding tool, electronic component mounting apparatus and electronic component mounting method

Abstract

A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

Dependencies are inferred from the claim text.