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US 2010/0140013 A1Published application
Multilayer board for reducing solid-borne sound
AssigneeAirbus Operations GmbH
InventorKlaus Boock
Life of this patent
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Abstract
A multilayer board for reducing solid-borne sound radiation with improved mechanical stability when subjected to a load, comprising a first cover layer, a second cover layer, and at least one core layer, wherein the at least one core layer is arranged between the first and the second cover layer, and wherein the at least one core layer comprises at least one first sloped slot.
Claims11
A multilayer board for reducing solid-borne sound radiation with improved mechanical stability when subjected to a load, the multilayer board comprising:
- a first cover layer,
- a second cover layer, and
- at least one core layer, wherein the at least one core layer is arranged between the first cover layer and the second cover layer, and wherein
- the at least one core layer comprises at least one first sloped slot.
1 more element
Dependencies are inferred from the claim text.