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US 2010/0139962 A1Published application
Wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorKentaro KANEKO
Life of this patent
Estimating the term…
Abstract
A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.
Claims10
A method of manufacturing a wiring board, comprising:
- forming a first resist layer on a support base member, the first resist layer being patterned to have an annular opening portion surrounding a portion corresponding to an electronic component mounting area;
- forming a sacrifice conductive layer on the support base member exposed from the opening portion of the first resist layer;
- removing the first resist layer to thereby leave a convex sacrifice conductive layer on a surface of the support base member, the convex sacrifice conductive layer surrounding the electronic component mounting area;
- forming a second resist layer on the support base member and the convex sacrifice conductive layer, the second resist layer being patterned to have an opening portion in a required shape at the portion corresponding to the electronic component mounting area;
- forming a pad on the support base member exposed from the opening portion of the second resist layer;
- forming an insulating layer on the support base member and the sacrifice conductive layer, with the pad being exposed from the insulating layer, after removing the second resist layer;
- forming on the insulating layer, a wiring layer including a via connected to the pad;
- alternately stacking a required number of insulating layers and wiring layers;
- and
- removing the support base member and the convex sacrifice conductive layer to thereby form a concave portion at a portion surrounding the electronic component mounting area in an outermost insulating layer.
7 more elements
A method of manufacturing a wiring board, comprising:
- forming a first resist layer on a support base member, the first resist layer being patterned to have only an annular portion surrounding an electronic component mounting area;
- forming a sacrifice conductive layer on the support base member exposed from the first resist layer;
- removing the first resist layer to thereby leave a concave sacrifice conductive layer on a surface of the support base member, the concave sacrifice conductive layer surrounding the electronic component mounting area;
- forming a second resist layer on the support base member and the concave sacrifice conductive layer, the second resist layer being patterned to have an opening portion in a required shape at a portion corresponding to the electronic component mounting area;
- forming a pad on the sacrifice conductive layer exposed from the opening portion of the second resist layer;
- forming an insulating layer on the support base member and the sacrifice conductive layer, with the pad being exposed from the insulating layer, after removing the second resist layer;
- forming on the insulating layer, a wiring layer including a via connected to the pad;
- alternately stacking a required number of insulating layers and wiring layers;
- and
- removing the support base member and the concave sacrifice conductive layer to thereby form a convex portion at a portion surrounding the electronic component mounting area in an outermost insulating layer.
7 more elements
A method of manufacturing a wiring board, comprising:
- forming on a support base member, a recessed portion or a projected portion in an annular shape surrounding a portion corresponding to an electronic component mounting area;
- forming a resist layer on a surface of the support base member where the recessed portion or projected portion is formed, the resist layer being patterned to have an opening portion in a required shape at the portion corresponding to the electronic component mounting area;
- forming a pad on the support base member exposed from the opening portion of the resist layer;
- forming an insulating layer on the support base member, with the pad being exposed from the insulating layer, after removing the resist layer;
- forming on the insulating layer, a wiring layer including a via connected to the pad;
- and
- alternately stacking a required number of insulating layers and wiring layers and then removing the support base member.
4 more elements
A wiring board comprising:
- a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween, and the plurality of wiring layers are connected to one another through a via formed in each of the insulating layers;
- and
- a recessed portion formed on an outermost insulating layer of the structure which is on a surface side where an electronic component is mounted, the recessed portion being formed in an annular shape surrounding an electronic component mounting area.
A wiring board comprising:
- a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween, and the plurality of wiring layers are connected to one another through a via formed in each of the insulating layers;
- and
- a projected portion formed on an outermost insulating layer of the structure which is on a surface side where an electronic component is mounted, the projected portion being formed in an annular shape surrounding an electronic component mounting area.
Dependencies are inferred from the claim text.