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US 2010/0139860 A1Published application
Bonding tool and method
AssigneeBAE SYSTEMS plc
InventorsMartyn John Hucker, Clyde Warsop
Life of this patent
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AssigneeBAE SYSTEMS plc
InventorsMartyn John Hucker, Clyde Warsop
Estimating the term…
A bonding tool and method A bonding tool and method for bonding together layers of a MEMS transducer device, including at least one layer of a piezoelectric material, and an intermediate reinforcing layer of titanium, or other metal, comprising: positioning the layers above one another and spaced apart by means of spacing members, heating said layers to a bonding temperature, and retracting the spacing members so as to bring the layers together under pressure to effect a bond between adjacent surfaces of the layers, wherein a press head is employed with a compliant caul for evenly distributing the press force; and permitting said layers to cool to an operating temperature in which said piezoelectric layer is under compressive strain and the titanium layer is under tensile strain.
A method of bonding together layers of a MEMS transducer device, including a first layer of a piezoelectric material, and a second layer of a metallic material having a thermal coefficient of expansion different from that of the first material, the method comprising the steps of:
A method according to any preceding claim, wherein said piezoelectric material is PZT, and said metallic reinforcing layer is titanium.
A method according to any preceding claim, comprising positioning a third layer, of similar material to said second layer, spaced from said first and second layers;
A bonding tool for bonding together layers of a MEMS transducer device, the device including a first layer of a piezoelectric material, and a second layer of a metallic material having a thermal coefficient of expansion different from that of the first material, and the bonding tool comprising:
A bonding tool for bonding together layers of a MEMS transducer device, the device including a first layer of a piezoelectric material, and a second layer of a metallic material having a thermal coefficient of expansion different from that of the first material, and the bonding tool comprising:
A bonding tool substantially as described with reference to the accompanying drawings.
Dependencies are inferred from the claim text.