Method of manufacturing semiconductor device, Exposure device, and recording medium
AssigneeNEC Electronics Corporation
InventorToshiaki Koshitaka
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor device includes a first absorption step, a releasing step, a second absorption step, and an exposure step. In the first absorption step, a wafer chuck of a wafer stage absorbs the semiconductor wafer to adjust the temperature of the semiconductor wafer. In the releasing step, the semiconductor wafer is released from the wafer chuck. In the second absorption step, a wafer chuck of a wafer stage for exposure absorbs the semiconductor wafer. In the exposure step, the semiconductor wafer is exposed.
Claims10
A method of manufacturing a semiconductor device, comprising:
- allowing a wafer chuck of a first wafer stage to absorb a semiconductor wafer to adjust the temperature of said semiconductor wafer;
- releasing said semiconductor wafer from said wafer chuck;
- allowing a wafer chuck of a wafer stage for exposure to absorb said semiconductor wafer;
- and
- exposing said semiconductor wafer.
An exposure device comprising:
- a wafer chuck that absorbs a semiconductor wafer;
- and
- a control unit that controls said wafer chuck,
- wherein, before an exposure process, said control unit performs a first absorption process of allowing said wafer chuck to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer, a releasing process of allowing said wafer chuck to release said semiconductor, and a second absorption process of allowing said wafer chuck to reabsorb said semiconductor wafer.
An exposure device comprising:
- a first wafer stage including a first wafer chuck that absorbs a semiconductor wafer;
- a second wafer stage for exposure including a second wafer chuck which absorbs said semiconductor wafer;
- a wafer moving mechanism that moves said semiconductor wafer;
- and
- a control unit that controls said wafer moving mechanism, said first wafer chuck, and said second wafer chuck,
- wherein said control unit performs a process of allowing said first wafer chuck of said first wafer stage to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer, a process of allowing said first wafer chuck to release said semiconductor wafer, a process of allowing said wafer moving mechanism to move said semiconductor wafer over said first wafer stage to said second wafer stage, and a process of allowing said second wafer chuck of said second wafer stage to absorb said semiconductor wafer.
A recording medium comprising a program stored therein that is installed in a control unit of an exposure device including a wafer chuck which absorbs a semiconductor wafer and said control unit which controls said wafer chuck, said program causes said control unit to perform, before an exposure process:
- a first absorption process of allowing said wafer chuck to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer;
- a releasing process of allowing said wafer chuck to release said semiconductor wafer;
- and
- a second absorption process of allowing said wafer chuck to reabsorb said semiconductor wafer.
A recording medium comprising a program stored therein that is installed in a control unit of an exposure device including a first wafer stage including a first wafer chuck which absorbs a semiconductor wafer, a second wafer stage for exposure including a second wafer chuck which absorbs said semiconductor wafer, a wafer moving mechanism which moves said semiconductor wafer, and said control unit which controls said wafer moving mechanism, said first wafer chuck, and said second wafer chuck, said program causes said control unit to perform, before an exposure process:
- a process of allowing said first wafer chuck of said first wafer stage to absorb said semiconductor wafer to adjust the temperature of said semiconductor wafer;
- a process of allowing said first wafer chuck to release said semiconductor wafer;
- a process of allowing said wafer moving mechanism to move said semiconductor wafer over said first wafer stage to said second wafer stage;
- and
- a process of allowing said second wafer chuck of said second wafer stage to absorb said semiconductor wafer.
Dependencies are inferred from the claim text.