Flexible substrate with electronic devices formed thereon
AssigneeEastman Kodak Company
InventorsTimothy J. Tredwell, Roger S. Kerr
Life of this patent
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Abstract
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
Claims16
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material;
- b) embedding a particulate material in at least one surface of the substrate;
- c) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;
- and
- d) forming a thin film electronic device on said surface with said particulate material.
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material as a base substrate;
- b) coating a composition material onto at least one surface of the base substrate, wherein the composition material comprises at least one plastic binder material and at least one particulate material, forming at least one coated surface thereby;
- and
- c) forming a thin film electronic device on said at least one coated surface.
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material and at least one particulate material;
- b) conditioning at least one surface of the substrate to increase the proportion of particulate material to plastic material at that surface;
- and
- c) forming a thin film electronic device on said at least one conditioned surface.
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises polytetrafluoroethylene (PTFE) and at least one particulate material;
- and
- b) forming a thin film electronic device on at least one surface of said substrate.
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises polytetrafluoroethylene (PTFE), at least one other plastic material, and at least one particulate material;
- and
- b) forming a thin film electronic device on at least one surface of said substrate.
A method of manufacturing an electronic device comprising:
- a) providing a substrate comprising polytetrafluoroethylene (PTFE) and at least one particulate material;
- b) laminating said substrate to a carrier;
- and
- c) forming an electronic device on the substrate.
A method of manufacturing an electronic device comprising:
- a) providing a substrate comprising polytetrafluoroethylene (PTFE), at least one particulate material, and at least one other plastic material;
- b) laminating said substrate to a carrier;
- c) forming an electronic device on the substrate;
- and
- d) delaminating the substrate containing the electronic device from the carrier.
Dependencies are inferred from the claim text.