Flexible diode package and method of manufacturing
AssigneeMicrosemi Corporation
InventorTracy Autry
Life of this patent
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Abstract
A single step packaging process that both melts a solder and also cures an adhesive about a microelectronic circuit. The process finds technical advantages by simplifying packaging of a die that may be coupled to a planar flexible lead, which leads to a lower production cost and quicker manufacturing time. The planar flexible lead may be adapted to bend and flex during mechanical stress and during extreme temperature cycling, and allow direct mounting of the device to a member by easily welding or soldering. The invention may comprise a flexible solar cell diode that can be closely positioned on solar panels at an extremely low cost.
Claims20
A method of packaging an integrated circuit with a first lead and a second lead, the method comprising the steps of:
- disposing a first member upon the first lead to define a recess;
- disposing a first solder preform in the recess;
- disposing a die upon the first solder preform;
- disposing a second solder perform upon the die;
- disposing a second member upon the first member;
- disposing the second lead upon the second member and over the die;
- and
- heating all of the above elements at a predetermined temperature to simultaneously both melt the first and second solder performs and also seal the first and second members to each other to form a seal about the die in a single step.
The method as specified 11 wherein the first member, the second member, and the third member are comprised of polymide.
The method as specified in claim 18 wherein the first lead comprises a cathode and the second lead comprises an anode.
Dependencies are inferred from the claim text.