Electroless nickel plating bath and method for electroless nickel plating
AssigneeC. Uyemura & Co., Ltd.
InventorsHiromu Inagawa, Daisuke Hashimoto, Shinji Ishimaru, Masayuki Kiso
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Abstract
Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at least the iron ion source and the iodide ion source, it is possible to suppress decomposition of the plating bath without using harmful metal species to stabilize the plating bath.
Claims15
An electroless nickel plating bath at least containing an iron ion source and an iodide ion source.
A stabilizer for an electroless nickel plating bath containing at least an iron ion source and an iodide ion source.
A method for electroless nickel plating comprising:
- immersing an object for plating in an electroless nickel plating bath containing at least an iron ion source and an iodide ion source to deposit an electroless nickel plating film on a surface of said object for plating.
A method for managing an electroless nickel plating bath by adding at least an iron ion source and an iodide ion source to the electroless nickel plating bath to preserve said bath.
An electroless nickel plating bath for depositing an electroless nickel plating film on a surface of an iron-based object for plating, wherein at least an iodide ion source is contained in said bath.
A method for electroless nickel plating wherein an iron-based object for plating is immersed in an electroless nickel plating bath containing at least an iodide ion source to deposit an electroless nickel plating film on a surface of said iron-based object.
Dependencies are inferred from the claim text.