Piezoelectric devices and methods for manufacturing same
AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsMitoshi Umeki, Takahiro Inoue, Yoshiaki Amano, Takefumi Saito
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AssigneeNihon Dempa Kogyo Co., Ltd.
InventorsMitoshi Umeki, Takahiro Inoue, Yoshiaki Amano, Takefumi Saito
Estimating the term…
Methods are disclosed for manufacturing piezoelectric vibrating pieces and devices including such pieces. According to an embodiment of the method, a piezoelectric vibrating piece is produced from a piezoelectric wafer. To form the piece, a profile of the piezoelectric vibrating piece is formed in a piezoelectric wafer. A first metal film (chromium; Cr) is formed on the surface of the piezoelectric piece. The chromium film is surface-oxidized to form a film having Cr foundation layer and an oxidized surface. A second metal film (gold; Au) is formed on the oxidized surface. Then, in selected regions not destined to become electrodes, the second metal film is removed, leaving electrode patterns at designated regions of the piezoelectric vibrating piece.
A method for manufacturing a piezoelectric vibrating piece, comprising:
A tuning-fork type piezoelectric vibrating piece, comprising:
A tuning-fork type piezoelectric vibrating piece, comprising:
Dependencies are inferred from the claim text.