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US 2010/0133695 A1Published application
Electronic circuit with embedded memory
OwnerSang-Yun Leeinventor
Life of this patent
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Abstract
Circuitry includes first and second circuits spaced apart by an interconnect region. The interconnect region includes a first interconnect, and the second circuit includes a stack of semiconductor layers. The first interconnect extends between the first and second circuits to provide communication therebetween. The second circuit operates as a memory circuit.
Claims20
Circuitry, comprising:
- a first circuit;
- an interconnect region, which includes a first interconnect;
- and
- a second circuit coupled to the interconnect region through a bonding interface, the second circuit including a stack of semiconductor layers;
- wherein the first and second circuits are in communication with each other through the bonding interface.
2 more elements
Circuitry, comprising:
- a substrate;
- control circuitry carried by the substrate;
- processor circuitry carried by the substrate;
- an interconnect region which provides communication between the processor and control circuitry;
- and
- memory circuitry carried by the interconnect region, the memory circuitry including a stack of semiconductor layers, wherein the stack includes a first planarized surface which faces the interconnect region.
3 more elements
Circuitry, comprising:
- a substrate;
- first and second processor circuits carried by the substrate;
- a control circuit carried by the substrate;
- an interconnect region carried by the substrate, the interconnect region allowing the first and second processor circuits to communicate with each other and the control circuit;
- and
- a memory circuit in communication with the control circuit through the interconnect region, the memory circuit including a planarized surface which faces the interconnect region.
3 more elements
Dependencies are inferred from the claim text.