Semiconductor Package Leads Having Grooved Contact Areas
AssigneeTexas Instruments Incorporated
InventorMohamad Ashraf Mohd ARSHAD
Life of this patent
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Abstract
A packaged semiconductor device (100) has a first (110) and a second (111) side, the second side including a plurality of metal terminals (120) extending to the first side. Each terminal includes an oblong groove (122) extending to the first side and ending in an orifice (123) at the first side. The terminals are made of a base metal and may have a solder-wettable surface except for the terminal surface (121) exposed at the first device side.
Claims13
An apparatus comprising:
- a packaged semiconductor device having a first and a second side, the second side including a plurality of terminals extending to the first side;
- and
- each terminal including a groove also extending to the first side and ending in an orifice at the first side.
A method for fabricating a leadframe for use in semiconductor devices, comprising the steps of:
- selecting a strip of a base metal patterned for use as a leadframe of adjoining semiconductor devices, the pattern including elongated leads of contiguous device segments, the leads having a length;
- and
- forming grooves into one surface of the leads, the grooves extending over the length of the leads.
A method for fabricating a semiconductor device comprising the steps of:
- providing a patterned leadframe strip of a base metal, the strip having a first and a second surface, the pattern including elongated leads composed of contiguous device segments, each lead having a length and one groove extending over the length, formed into the first surface;
- assembling semiconductor chips on the second surface of the leadframe strip;
- encapsulating the leadframe strip in a polymer compound so that the first surface of the leads remains un-encapsulated;
- and
- singulating discrete devices from the strip by sawing along cut planes through the compound and the leads, wherein the leads are separated in the device terminals and the base metal of the leads and an orifice for the grooves in each terminal are exposed.
Dependencies are inferred from the claim text.