Direct semiconductor contact ebullient cooling package
AssigneeThe Boeing Company
InventorsAndrew G. Laquer, Ernest E. Bunch
Life of this patent
Estimating the term…
Abstract
The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
Claims21
A semiconductor package, comprising:
- a semiconductor chip having at least one heat-generating semiconductor device;
- and
- a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber entirely filled with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device;
- wherein
- the semiconductor chip is coupled to a substrate;
- and
- the volumetrically expandable chamber is formed by structures comprising a concave structure sealingly coupled directly to the substrate on a substrate surface facing the semiconductor chip.
(canceled)
A method of cooling a heat-generating semiconductor device, comprising the steps of:
- sealingly surrounding the semiconductor device in a volumetrically expandable chamber;
- entirely filling the volumetrically expandable chamber with a non-electrically conductive liquid that contacts the semiconductor device;
- and
- passively circulating the non conductive liquid within the volumetrically expandable chamber by the generated heat from the semiconductor device to cool the semiconductor device.
A method of cooling a semiconductor device, comprising the steps of:
- absorbing heat from a semiconductor device via a non-conductive inert liquid in contact with the semiconductor device;
- sealingly enclosing the semiconductor device and the non-electrically conductive inert liquid in a volumetrically expandable chamber;
- and
- passively circulating the non-electrically conductive inert liquid within the volumetrically expandable chamber at least in part by the heat drawn from the semiconductor device.
Dependencies are inferred from the claim text.