Power semiconductor device

A power semiconductor device comprising:

• a power semiconductor module sealed with transfer molding resin;
• and
• an insert case for setting the power semiconductor module therein, wherein
• the power semiconductor module includes:
• power semiconductor elements mounted on a wiring pattern of a circuit substrate;
• and
• cylindrical conductors, having openings, joined to the wiring pattern so as to be substantially perpendicular to the wiring pattern, the openings being exposed at a surface of the transfer molding resin,
• the insert case includes:
• a ceiling portion and peripheral walls;
• an open portion which faces the ceiling portion;
• and
• external terminals which are fitted into, and passed through, the ceiling portion and which have outer-surface-side connecting portions at an outer surface side of the ceiling portion and inner-surface-side connecting portions at an inner surface side of the ceiling portion, and
• the power semiconductor module is set within the insert case, such that the inner-surface-side connecting portions of the external terminal are inserted into the cylindrical conductors.