US 2010/0133662 A1 · SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

Abstract

Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of manufacturing a semiconductor device includes forming a plurality of first side trenches to an intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes removing material from a second side of the molded portion at areas aligned with the first side trenches, wherein removing the material forms openings through the molded portion. The method further includes forming a plurality of electrical contacts at the second side of the molded portion at the openings and electrically connecting the second side contacts to corresponding bond-sites on the dies.

Claims9

Dependent claims

An intermediate article of manufacture comprising:

a molded wafer having a molding material shaped into a wafer having a first side and a second side, a first semiconductor die in the molding material, and a second semiconductor die in the molding material spaced apart from the first die;
a first trench in the first side of the molded wafer between the first and second dies, wherein the first trench has a depth less than a thickness of the molded wafer;
and
a depression in the second side of the molded wafer aligned with the first trench, wherein the depression has a depth that is less than the thickness of the molded wafer and forms a first opening through the molded wafer at an intersection with the first trench between the first and second dies.

1 more element

Dependencies are inferred from the claim text.

Semiconductor assemblies and methods of manufacturing such assemblies

Life of this patent

Semiconductor assemblies and methods of manufacturing such assemblies

Life of this patent

Abstract

Claims9