Semiconductor device and method of manufacturing semiconductor integrated circuit chip

A method of manufacturing a semiconductor chip, comprising a step of radiating a laser beam to a first metal film and a second metal film at the same time and exploding the first and second metal films in a semiconductor substrate;

• said substrate having a plurality of circuit regions and a scribe region formed around the circuit regions for separating the respective circuit regions, the scribe region having a plurality of laminated interlayer films including a plurality of metal films and optically-transparent insulation films formed between and on the plurality of metal films, wherein the first metal film is included in a first upper interlayer film of the plurality of interlayer films and is located at a position where it does not directly overlap the second metal film included in a second lower interlayer film under the first interlayer film in a vertical direction.