Semiconductor device
AssigneeNEC Electronics Corporation
InventorsYoshitaka Kubota, Hiromichi Takaoka, Hiroshi Tsuda
Life of this patent
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AssigneeNEC Electronics Corporation
InventorsYoshitaka Kubota, Hiromichi Takaoka, Hiroshi Tsuda
Estimating the term…
A semiconductor device includes an electric fuse formed on a substrate. The electric fuse includes: a first interconnect formed on one end side thereof; a second interconnect formed in a layer different from a layer in which the first interconnect is formed; a first via provided in contact with the first interconnect and the second interconnect to connect those interconnects; a third interconnect formed on another end side thereof, the third interconnect being formed in the same layer in which the first interconnect is formed, as being separated from the first interconnect; and a second via provided in contact with the third interconnect and the second interconnect to connect those interconnects, the second via being lower in resistance than the first via. The electric fuse is disconnected by a flowing-out portion to be formed of a conductive material forming the electric fuse which flows outwardly during disconnection.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.