Top contact led thermal management
AssigneeBridgelux, Inc.
InventorWei Shi
Life of this patent
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Abstract
An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.
Claims9
A method for forming an LED die, the method comprising forming an extended bond pad upon at least one of a p-type material and an n-type material, wherein the bond pad(s) are configured to enhance heat flow from an active region of the LED to a lead frame.
A method for fabricating an LED die, the method comprising:
- providing a substrate;
- forming a layer of n-type material upon the substrate;
- forming a layer of p-type material upon the substrate, the p-type material cooperating with the n-type material to define an active region;
- and
- forming at least one bond pad upon at least one of the n-type material and the p-type material, the bond pad being configured to facilitate attachment of the LED to a lead frame and being configured to facilitate heat flow from an active region of the LED to a lead frame.
A method for fabricating an LED assembly, the method comprising:
- providing at least one die;
- and
- attaching the die/dice to a lead frame via a bond pad formed upon the die/dice, the bond pad being configured to facilitate heat flow from the die to a lead frame.
Dependencies are inferred from the claim text.