Method for producing electronic component and electronic component
OwnerWerner Hoffmann, Roland Höfer +2inventors
InventorsWerner Hoffmann, Roland Höfer, Herbert Schwarzbauer, Karl Weidner
Life of this patent
Estimating the term…
Abstract
A plurality of chips disposed in a wafer on a passivated main side, having at least one chip contact surface, is provided with an insulation layer. The insulation layer has openings in the area of the at least one chip contact surface of each chip. The chip contact surfaces of each chip are provided with a chip contact surface metallization of a prescribed thickness, and the chips disposed in the water are separated therefrom.
Claims24
1-23. (canceled)
A method for producing an electronic component, comprising:
- providing a plurality of chips arranged on a wafer with an insulation layer on a main side having a least one chip contact surface and passivated;
- providing the insulation layer with openings in an area of the at least one chip contact surface of respective chips;
- providing the chip contact surfaces of the respective chips with a chip contact surface metallization of a predetermined thickness;
- and
- separating the chips from the wafer.
A chip module electrically connected in planar connection technology with at least one of a substrate and other components, said chip module comprising:
- an electronic component including a chip having a passivated main side with at least one chip contact surface, each chip contact surface provided with an insulation layer having an opening and a chip contact surface metallization of a predetermined thickness in the opening of the insulation layer.
An electronic component, comprising:
- a chip having a passivated main side with at least one chip contact surface, each chip contact surface provided with an insulation layer having an opening and a chip contact surface metallization of a predetermined thickness in the opening of the insulation layer.
Dependencies are inferred from the claim text.