Metal-based photonic device package module and manufacturing method thereof

A method of manufacturing a metal-based photonic device package module, comprising:

• preparing a plate-shaped metal substrate;
• forming a metal oxide layer having a mounting cavity by performing selective anodic oxidation on the metal substrate to a predetermined depth;
• forming a reflecting plane by plating an inner surface of the mounting cavity of the metal oxide layer;
• and
• mounting a photonic device in the mounting cavity of the metal oxide layer on the metal substrate.

A method of manufacturing a metal-based photonic device package module, comprising:

• preparing a plate-shaped metal substrate;
• forming a metal oxide layer by performing anodic oxidation on the metal substrate to a predetermined depth;
• forming a mounting cavity by etching or drilling a portion of the metal oxide layer;
• forming a reflecting plane on an inner surface of the metal oxide layer;
• and
• mounting a photonic device in the mounting cavity of the metal oxide layer on the metal substrate.

A method of manufacturing a metal-based photonic device package module, comprising:

• preparing a plate-shaped metal substrate;
• forming a step-shaped space portion by performing an etching process or a pressing process on a portion of the metal substrate;
• forming a metal oxide layer on the metal substrate;
• etching the metal substrate to a lower surface of the metal oxide layer and planarizing a bottom surface thereof;
• forming a mounting cavity and a contact hole on the metal oxide layer;
• and
• forming a reflecting plane at an inner surface of the mounting cavity and mounting a photonic device in the mounting cavity on the metal substrate.

A metal-based display apparatus, comprising:

• a metal substrate that is formed in the shape of a plate;
• a metal oxide layer that is formed on the metal substrate to have a plurality of mounting cavities;
• photonic devices that are mounted in inner portions of some portions of the mounting cavities of the metal oxide layer;
• reflecting planes that are formed at inner surfaces of the mounting cavities of the metal oxide layer where the photonic devices are mounted by using a material selected from a metal such as gold, silver, copper, platinum, and palladium, or an alloy thereof;
• driver chips that are mounted at inner portions of other portions of the mounting cavities of the metal oxide layer;
• and
• connection wire lines that are formed on the metal oxide layer to be electrically connected to the photonic devices and the driver chips.