Environmental barrier coating for organic semiconductor devices and methods thereof

An environmental barrier coating, comprising:

• a primary barrier layer disposed on a surface of an organic component, wherein the primary barrier layer is a non-conformal layer formed by plasma enhanced chemical vapor deposition having a thickness of about 20 nanometers to about 500 nanometers;
• a secondary barrier layer disposed on the primary barrier layer, wherein the secondary barrier layer is a conformal layer formed by atomic layer deposition having a thickness of less than or equal to about 50 nanometers;
• and
• a passivation layer disposed on the secondary barrier layer, wherein the passivation layer reduces exposure of the primary and secondary barrier layers to moisture and oxygen.

A method of fabricating an environmental barrier coating, the method comprising:

• disposing a non-conformal primary barrier layer on a surface of an organic component;
• disposing a conformal secondary barrier layer on the primary barrier layer by atomic layer deposition;
• and
• disposing a passivation layer on the secondary barrier layer, wherein the passivation layer reduces exposure of the primary and secondary barrier layers to moisture and oxygen.