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AssigneeKomatsu Denshi Kinzouku Kabushi Kaisha
InventorsMariko WAKUDA, Ichiro Sato
Estimating the term…
An apparatus and a method are provided for accurately analyzing and evaluating a degree of contamination on a chamfered part without mixing impurities from parts other than the chamfered part into chemicals. At a position in which, on a front plane flat part of a semiconductor wafer, a boundary region bordering the chamfered part can come into contact with the chemicals, a radius direction position of the chemicals (a distance between a chemicals center and a wafer center) is determined, scanning is performed in a circumference direction, and the chemicals including impurities are collected. Then, at a position that can be brought into contact with the both chamfered part of the semiconductor wafer and the boundary region, a radius direction position of the chemicals is determined, scanning is performed in the circumference direction and the chemicals including impurities are collected. A liquid drop holder is, for instance, relatively rotated in the circumference direction from a desired start point on the circumference of the semiconductor wafer to a finish point.
1-7. (canceled)
A Method for collecting impurities from the surface of a semiconductor wafer in which impurities are removed from the wafer's surface by moving a liquid drop relative to the surface of the wafer so as to dissolve impurities into the liquid drop, the method comprising:
A device for collecting impurities from the surface of a semiconductor wafer, in which impurities are removed from a wafer's surface by moving a liquid drop relative to the surface of a wafer so as to dissolve impurities into the drop, making the drop move in a circumference direction on the front plane of the semiconductor wafer and moving a liquid drop holder radially on the semiconductor wafer, the device comprising:
A method for collecting impurities from the surface of a semiconductor wafer, in which impurities are collected by dissolving the impurities in a liquid drop that is moved in a circumference direction of the semiconductor wafer so that the liquid drop contacts a front plane of the semiconductor wafer, the method comprising:
A device for collecting impurities from a semiconductor wafer, in which impurities are removed from the wafer's surface by moving a liquid drop relative to the surface of the semiconductor wafer so as to dissolve impurities into the liquid drop, the device comprising:
Dependencies are inferred from the claim text.