Thermoelectric heat transferring unit

A thermoelectric heat transferring unit for transferring heat between an enclosed space and outside of the enclosed space, comprising:

• a thermoelectric cooling and heating module;
• an electronic control and power module;
• an air intake duct facing towards an external side;
• and
• an air return duct facing towards the external side,
• wherein the thermoelectric cooling and heating module includes an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper air flow chamber and the lower air flow chamber,
• said upper air flow chamber has an air inlet and an air outlet communicating with the enclosed space, and said lower air flow chamber is connected with the air intake duct and the air return duct,
• each of the chambers has a heat sink with heat sink fins and is connected to the array of thermoelectric chips, and
• the electronic control and power module controls the heat to be transferred from said upper air flow chamber via the array of thermoelectric chips to said lower air flow chamber in a cooling mode, and controls the heat to be transferred from said lower air flow chamber via the array of thermoelectric chips to said upper air flow chamber in a heating mode.

A method for transferring heat between an enclosed space and outside of the enclosed space, comprising:

• providing a thermoelectric heat transferring unit including a thermoelectric cooling and heating module, an electronic control and power module, an air intake duct facing towards an external side, and an air return duct facing towards the external side, the thermoelectric cooling and heating module having an upper air flow chamber arranged on the enclosed-space side, a lower air flow chamber arranged on the external side, and at least one array of thermoelectric chips sandwiched directly between the upper air flow chamber and the lower air flow chamber, said upper air flow chamber having an air inlet and an air outlet communicating with the enclosed space, and said lower air flow chamber being connected with the air intake duct and the air return duct, each of the chambers having a heat sink with heat sink fins and is connected to the array of thermoelectric chips;
• transferring the heat from said upper air flow chamber via the array of thermoelectric chips to said lower air flow chamber in a cooling mode;
• and
• transferring the heat from said lower air flow chamber via the array of thermoelectric chips to said upper air flow chamber in a heating mode.