Semiconductor wafer processing apparatus, reference angular position detection method, and semiconductor wafer

Abstract

[Problems] To provide a semiconductor wafer processing apparatus and reference angular position detection method able to suitably detect a reference angular position for a semiconductor wafer for which a reference angular position is set and a semiconductor wafer for which a reference angular position is suitably set. [Means for Solving Problems] A semiconductor wafer (100) is formed at part of an outer circumference edge part (101) with a crystal orientation detection flat surface (102) vertical to the diametrical direction at a position forming a predetermined angle with the crystal orientation. The semiconductor wafer processing apparatus successively captures images of the outer circumference edge part (101 of this semiconductor wafer (100) in the circumferential direction, generates first outer circumference bevel surface (101b) length data, outer circumference end face (101a) length data, and second outer circumference bevel surface (101c) length data expressing the outer circumference edge shape, and detects the angular position at which the first outer circumference bevel surface (101c) length data and second outer circumference bevel surface (101b) length data are minimum and the outer circumference end face (101a) length data is maximum as the reference angular position.

Dependencies are inferred from the claim text.