US 2010/0075158 A1 · THERMOSETTING COMPOSITION

Abstract

A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, an epoxy silicone, and a silicone elastomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Claims10

Dependent claims

A thermosetting composition comprising an aluminosiloxane, a silicone oil comprising silanol groups at both ends, an epoxy silicone, and a silicone elastomer.

Dependencies are inferred from the claim text.

Facts

Application

12/549,956Filed 28 Aug 2009

Priority

JP 2008-24265322 Sep 2008

Published

25 Mar 2010

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

C08G 77/58
In which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms: metal-containing linkages
C08L 83/06
Polysiloxanes: containing silicon bound to oxygen-containing groups
C08L 83/14
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with…
H10W 74/476
Comprising organic materials, e.g. plastics or resins: organic materials comprising silicon

Thermosetting composition

Life of this patent

Thermosetting composition

Life of this patent

Abstract

Claims10