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US 2010/0073886 A1Published application
Sensor board and producing method thereof
AssigneeNitto Denko Corporation
InventorsHiroyuki Hanazono, Hiroshi Yamazaki
Life of this patent
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Abstract
A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
Claims4
A method for producing a sensor board comprising the steps of:
- preparing an insulating layer;
- forming at least a pair of electrodes on the insulating layer;
- and
- forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
1 more element
A sensor board obtained by a method for producing a sensor board comprising the steps of:
- preparing an insulating layer;
- forming at least a pair of electrodes on the insulating layer;
- and
- forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
1 more element
Dependencies are inferred from the claim text.