Heat dissipation device
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorPENG LIU
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substrate and sandwiched between the heat spreaders. A plurality of first channels are defined in the first fin unit and parallel to the heat spreaders. Each of the second fin units is perpendicularly arranged on the substrate and located at a lateral, outer side of one of the heat spreaders. A plurality of second channels are defined in each of the second fin units and extend along a different direction compared to that of the first channels.
Claims15
A heat dissipation device for cooling an electronic component, the heat dissipating device comprising:
- a base having a substrate with a bottom thereof for attaching to the electronic component, two heat spreaders integrally extending upwardly from a top of the substrate, the heat spreaders being parallel to each other;
- a first fin unit comprising a plurality of parallel fins arranged on the substrate and sandwiched between the heat spreaders, the first fin unit defining pluralities of first channels therein;
- and
- two second fin units each comprising a plurality of parallel fins and arranged on the substrate and located at a lateral, outer side of one of the heat spreaders, each of the second fin units defining pluralities of second channels therein;
- wherein the fins of the two second fin units extend in a direction perpendicular to the substrate and the heat spreaders, and extending directions of the first and second channels are perpendicular to each other.
(canceled)
A heat dissipation device for cooling a major electronic component and other electronic components adjacent to the heat dissipation device, the heat dissipation device comprising:
- a base having a substrate and two parallel heat spreaders extending upwardly and perpendicularly from the substrate, the substrate being adapted for contacting with the major electronic component;
- a first fin unit arranged on the substrate and sandwiched between the heat spreaders, a plurality of first channels being defined in the first fin unit and parallel to the heat spreaders;
- two second fin units each being arranged on the substrate and located at a lateral, outer side of one of the heat spreaders, each of the second fin units defining a plurality of second channels therein, fins of the two second fin units extending in a direction perpendicular to the substrate and the heat spreaders, and an extending direction of the second channels being perpendicular to that of the first channels;
- and
- a fan arranged on the first and second fin units, wherein cooling air generated by the fan flows along the first and second channels out of the heat dissipation device multidirectionally, adapted for cooling the other electronic components adjacent to the heat dissipation device.
(canceled)
Dependencies are inferred from the claim text.