Heat dissipation device and computer using same
AssigneesFurui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsCHING-BAI HWANG, JIN-GONG MENG, CHENG-JEN LIANG
Life of this patent
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Abstract
A heat dissipation device includes a fin unit, a heat spreader and a heat isolation layer. The heat spreader contacts the fin unit and transfers heat to the fin unit for dissipation. The heat isolation layer is coated on an outer surface of the heat dissipation device. The heat isolation layer is polyurethane foam.
Claims20
A heat dissipation device comprising:
- a fin unit;
- a heat spreader contacting the fin unit and transferring heat thereto for dissipation;
- and
- a heat isolation layer coated on an outer surface of heat dissipation device, the heat isolation layer comprising polyurethane foam.
A computer comprising:
- a top cover;
- a bottom cover opposite the top cover;
- an electronic component located on the bottom cover;
- and
- a heat dissipation device received in the computer and located between the two covers, the heat dissipation device comprising a fin unit and a heat spreader, the heat spreader thermally interconnecting the fin unit and the electronic component, an outer surface of the heat dissipation device facing and adjacent to the two covers, a heat isolation layer coated on the outer surface of the heat dissipation device, and wherein the heat isolation layer comprises polyurethane foam.
A heat dissipation device for dissipating heat generated by an electronic component in a laptop computer comprising a top cover and a bottom cover, the heat dissipation device comprising:
- a heat spreader having a first portion for thermally connecting with the electronic component to absorb the heat therefrom and a second portion;
- a fin unit thermally connecting with the second portion of the heat spreader for dissipating the heat away from the heat spreader;
- and
- a heat isolation layer coated on a surface of at least one of the fin unit and the heat spreader which faces and is adjacent to at least one of the top and bottom covers of the laptop computer when the heat dissipation device is deployed in the laptop computer.
Dependencies are inferred from the claim text.