Piezoelectric microspeaker and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-kyun Kim, Seok-whan Chung, Byung-gil Jeong
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Abstract
Provided is a method of fabricating a piezoelectric microspeaker. According to the method, drive units having a piezoelectric layer and an electrode are symmetrically formed so as to be disposed over and under a diaphragm, respectively. When a thin conductive layer is used as the diaphragm, the diaphragm can be used as a common electrode. On the other hand, when a thin non-conductive layer is used as the diaphragm, a common electrode is necessary in each of the drive units.
Claims11
A method of fabricating a piezoelectric microspeaker, the method comprising:
- forming a lower drive unit by:
- forming a first drive electrode by depositing a first thin conductive layer on a substrate and etching the first conductive layer,
- forming a first piezoelectric plate by depositing a first piezoelectric layer on the first drive electrode and etching the first piezoelectric layer, and
- forming a first common electrode by depositing a second conductive layer on the first piezoelectric plate and etching the second conductive layer;
- forming a diaphragm by depositing a non-conductive layer on the first common electrode;
- and
- forming an upper drive unit by:
- forming a second common electrode by depositing a third conductive layer on the diaphragm and etching the third conductive layer,
- forming a second piezoelectric plate by depositing a second piezoelectric layer on the second common electrode and etching the second piezoelectric layer, and
- forming a second drive electrode by depositing a fourth conductive layer on the second piezoelectric plate and etching the fourth conductive layer.
A method of fabricating a piezoelectric microspeaker, the method comprising:
- forming a lower drive unit by depositing a first conductive layer on a substrate, etching the first conductive layer, and depositing a first piezoelectric layer on the first conductive layer, and etching the first piezoelectric layer;
- forming a diaphragm by depositing a second conductive layer on the lower drive unit and etching the second conductive layer;
- and
- forming an upper drive unit by depositing a second piezoelectric layer on the diaphragm, etching the second piezoelectric layer, depositing a third conductive layer on the second piezoelectric layer, and etching the third conductive layer.
A piezoelectric microspeaker fabricated according to a method comprising:
- forming a lower drive unit by:
- forming a first drive electrode by depositing a first thin conductive layer on a substrate and etching the first conductive layer,
- forming a first piezoelectric plate by depositing a first piezoelectric layer on the first drive electrode and etching the first piezoelectric layer, and
- forming a first common electrode by depositing a second conductive layer on the first piezoelectric plate and etching the second conductive layer;
- forming a diaphragm by depositing a non-conductive layer on the first common electrode;
- and
- forming an upper drive unit by:
- forming a second common electrode by depositing a third conductive layer on the diaphragm and etching the third conductive layer,
- forming a second piezoelectric plate by depositing a second piezoelectric layer on the second common electrode and etching the second piezoelectric layer, and
- forming a second drive electrode by depositing a fourth conductive layer on the second piezoelectric plate and etching the fourth conductive layer.
A piezoelectric microspeaker fabricated according to a method comprising:
- forming a lower drive unit by depositing a first conductive layer on a substrate, etching the first conductive layer, depositing a first piezoelectric layer on the first conductive layer, and etching the first piezoelectric layer;
- forming a diaphragm by depositing a second conductive layer on the lower drive unit and etching the second conductive layer;
- and
- forming an upper drive unit by depositing a second piezoelectric layer on the diaphragm, etching the second piezoelectric layer, depositing a third conductive layer on the second piezoelectric layer, and etching the third conductive layer.
Dependencies are inferred from the claim text.