Patterning method
AssigneeKabushiki Kaisha Toshiba
InventorsHiroshi TOKUE, Ikuo YONEDA, Shinji MIKAMI, Takumi OTA
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AssigneeKabushiki Kaisha Toshiba
InventorsHiroshi TOKUE, Ikuo YONEDA, Shinji MIKAMI, Takumi OTA
Estimating the term…
A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.
A patterning method for forming a pattern by transferring a concavo-convex pattern formed on a first template in a resist agent arranged between an underlying film formed on a substrate and the first template, the patterning method comprising:
A patterning method for forming a pattern by transferring a concavo-convex pattern formed on a first template in a resist agent applied on an underlying film formed on a substrate, the patterning method comprising:
Dependencies are inferred from the claim text.