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US 2010/0072610 A1Published application
Process for Precision Placement of Integrated Circuit Overcoat Material
AssigneeTexas Instruments Incorporated
InventorsSean M. MALOLEPSZY, Rex W. PIRKLE
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Abstract
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
Claims3
An integrated circuit package, comprising:
- an integrated circuit chip;
- a linearly patterned layer of overcoat material located over an area of the integrated circuit chip, the layer of overcoat material;
- and
- a mold structure surrounding at least a portion of the integrated circuit chip and the layer of overcoat material.
1 more element
Dependencies are inferred from the claim text.