Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming first solder bumps over the substrate;
• mounting a first semiconductor die to the substrate, the first semiconductor die having a plurality of contact pads formed over its active surface;
• depositing an encapsulant over the substrate, first solder bumps, and first semiconductor die;
• removing a first portion of the encapsulant to expose the first solder bumps and contact pads of the first semiconductor die;
• and
• forming a conductive layer over the encapsulant to connect the first solder bumps and contact pads of the first semiconductor die.

A method of making a semiconductor device, comprising:

• providing a substrate;
• forming an interconnect structure over the substrate;
• mounting a semiconductor die to the substrate, the semiconductor die having a plurality of contact pads formed over its active surface;
• depositing an encapsulant over the substrate;
• removing a first portion of the encapsulant to expose the interconnect structure and contact pads of the semiconductor die;
• and
• forming a conductive layer over the encapsulant to connect the interconnect structure and contact pads of the semiconductor die.

A semiconductor device, comprising:

• a semiconductor die having a plurality of contact pads formed over a surface of the semiconductor die;
• an interconnect structure disposed around a perimeter of the semiconductor die;
• an encapsulant formed over the interconnect structure and semiconductor die;
• a plurality of vias formed into the encapsulant to expose the interconnect structure and contact pads of the semiconductor die;
• and
• a conductive layer conformally formed over the encapsulant to electrically connect the interconnect structure and contact pads of the semiconductor die.