Quad flat pack in quad flat pack integrated circuit package system

An integrated circuit package system comprising:

• providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with bond wires, and the inner lead partially encapsulated by an inner encapsulation and further connected to a heat sink above the first integrated circuit;
• mounting an outer lead on the periphery of the base package;
• mounting a second integrated circuit above the base package and connected to the outer lead with the bond wires;
• and
• partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.

An integrated circuit package system comprising:

• a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation;
• an outer lead mounted on the periphery of the base package;
• a second integrated circuit mounted above the base package and connected to the outer lead with the interconnects;
• and
• an outer encapsulation partially encapsulating, the base package and the outer lead with leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed.