Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region Around Semiconductor Die

A method of making a semiconductor device, comprising:

• providing a substrate having a ground plane disposed on a surface of the substrate;
• mounting a semiconductor die over the substrate;
• depositing an encapsulant over the substrate and semiconductor die;
• forming a shielding layer over the semiconductor die;
• creating a channel in a peripheral region around the semiconductor die through the shielding layer, encapsulant and substrate at least to a depth of the ground plane;
• and
• forming a conductive via in the channel to electrically connect the shielding layer and ground plane.

A method of making a semiconductor device, comprising:

• providing a substrate having a ground plane disposed on a surface of the substrate;
• mounting a semiconductor die over the substrate;
• depositing an encapsulant over the substrate and semiconductor die;
• creating a channel in a peripheral region around the semiconductor die through the encapsulant and substrate at least to the ground plane;
• and
• forming a shielding layer over the semiconductor die, the shielding layer extending through the channel to the ground plane.

A method of making a semiconductor device, comprising:

• providing a substrate having a ground plane disposed on a surface of the substrate;
• mounting a semiconductor die over the substrate;
• forming a shielding layer over the semiconductor die;
• depositing conductive material between the shielding layer and ground plane;
• depositing an encapsulant over the substrate and semiconductor die;
• and
• creating a channel in a peripheral region around the semiconductor die through the conductive material and substrate at least to the ground plane, the channel being less than a diameter of the conductive material so that a portion of the conductive material remains to electrically connect the shielding layer to the ground plane.

A semiconductor device, comprising:

• a substrate having a ground plane disposed on its surface;
• a semiconductor die mounted over the substrate;
• an encapsulant deposited over the semiconductor die and substrate;
• and
• a shielding layer formed over the semiconductor die, the shielding layer being electrically connected to ground plane to isolate the semiconductor die from interference.