Semiconductor device and manufacturing method thereof
AssigneeYamaha Corporation
InventorsHiroshi SAITOH, Toshihisa SUZUKI, Shingo SAKAKIBARA
Life of this patent
Estimating the term…
Abstract
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
Claims15
A semiconductor unit for manufacturing a semiconductor device in which a semiconductor chip is mounted on an individual substrate and covered by a lid, the semiconductor unit comprising:
- a substrate plate member on which a plurality of said semiconductor chips are mounted;
- a plurality of said lids which individually cover said plurality of semiconductor chips, the plurality of lids being fixed to said substrate plate member;
- and
- cutouts formed in said substrate plate member for dividing said substrate plate member into said individual substrates.
A lid used on a semiconductor device configured with a semiconductor chip mounted in a hollow section of a substrate, said lid comprising:
- a substantially plate-shaped top plate section arranged opposing said hollow section;
- and
- at least one pair of side wall sections that project from a periphery of said top plate section towards said substrate and that engage with a side surface of said substrate.
Dependencies are inferred from the claim text.