Lead frame assembly, lead frame and insulating housing combination, and led module having the same
AssigneesSilitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
InventorsShih-Chung Huang, Chen-Hsiu Lin, Meng-Sung Chou
Life of this patent
Estimating the term…
Abstract
A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.
Claims20
A unitary conductive lead frame assembly having a plurality of lead frame sets, wherein each of said lead frame sets comprising:
- a first lead frame unit having a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction, and
- at least two second lead frame units disposed between said first and second frame portions and spaced apart from each other along the second direction, each of said second lead frame units cooperating with said first lead frame unit to define at least one first die-bonding area therebetween.
A light emitting diode (LED) module comprising:
- a plurality of lead frame sets comprising
- a first lead frame unit having a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction, and
- at least two second lead frame units disposed between said first and second frame portions and spaced apart from each other along the second direction, each of said second lead frame units cooperating with said first lead frame unit to define at least one first die-bonding area therebetween;
- an insulating housing molded on said lead frame set and having a plurality of cavities, each of said first die-bonding areas of said conductive lead frame set being exposed within a corresponding one of said cavities;
- and
- a plurality of light emitting dies mounted respectively at said first die-bonding areas of said conductive lead frame set.
Dependencies are inferred from the claim text.