Memory Module Assembly and Heat Sink thereof
OwnerMing-Yang Hsiehinventor
Life of this patent
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Abstract
A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.
Claims11
A heat sink assembly comprising:
- a heat dissipating plate having a top surface, a bottom surface and a first slit extending through the heat dissipating plate from the top to bottom surfaces;
- and
- a heat transfer medium including a base secured on the top surface of the heat dissipating plate and a first connecting sheet extending from an end of the base and through the first slit for snugly joining to a side of a first heat source.
A heat sink assembly comprising:
- a heat dissipating plate having a top surface and a bottom surface;
- and
- a heat transfer medium including two resilient sheets extending from the bottom surface of the heat dissipating plate;
- the two resilient sheets being outwardly biased in order to be snugly sandwiched in between two adjacent heat sources.
A heat sink assembly comprising:
- a heat dissipating plate having a top surface and a bottom surface;
- and
- a heat transfer medium including two resilient sheets extending from the bottom surface of the heat dissipating plate;
- the two resilient sheets being inwardly biased in order to snugly clip to opposite sides of a heat source.
Dependencies are inferred from the claim text.