Methods for fabricating faceplate of semiconductor apparatus
AssigneeApplied Materials, Inc.
InventorsTIEN FAK TAN, Lun Tsuei, Shaofeng Chen, Felix Rabinovich, Dmitry Lubomirsky, Kimberly Hinckley
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Abstract
A method for manufacturing a faceplate of a semiconductor apparatus is provided. The method includes selecting a size of a tool in response to a predetermined specification of a predetermined gas parameter. The tool is used to form the holes within the faceplate. A first gas parameter of the holes of the faceplate is measured by an apparatus to determine if the measured first gas parameter of the holes of the faceplate is within the predetermined specification.
Claims12
A method for manufacturing a faceplate of a semiconductor apparatus, comprising:
- selecting a size of a tool according to a predetermined specification of a predetermined gas parameter;
- using the tool to form the holes within the faceplate;
- and
- measuring a first gas parameter of the holes of the faceplate by an apparatus to determine if the measured first gas parameter of the holes of the faceplate is within the predetermined specification.
A method for manufacturing a faceplate of a semiconductor apparatus, comprising:
- measuring a gas parameter of holes of a coupon according to a predetermined specification of a gas parameter of a semiconductor manufacturing process;
- determining if the measured gas parameter of the coupon is within the predetermined specification to select a size of a tool;
- using the tool to form the holes within the faceplate;
- and
- measuring a gas parameter of the holes of the faceplate by an apparatus to determine if the measured gas parameter of the holes of the faceplate is within the predetermined specification.
Dependencies are inferred from the claim text.