Component Placement Apparatus, Component Placement Setting Calculation Apparatus, Program, and Component Placement Setting Calculation Method

A component placement setting calculation apparatus which generates component placement setting information for specifying sequencing for picking up and placing components by each of multiple placement heads, when the multiple placement heads operate simultaneously to pick up components from a pallet and operate simultaneously to place the components on a circuit board arranged in one direction with respect to the pallet, wherein,

• the component placement setting calculation apparatus comprises a controller to perform a processing, during one operation that the multiple placement heads pick up the components from the pallet and place the components on the circuit board, for specifying a pair of component groups to be simultaneously picked up from the pallet by the multiple placement heads so that an area where the multiple placement heads move in an overlapping manner is minimized, and
• a processing for generating the component placement setting information that allows each of the placement heads to operate simultaneously to pick up the components included respectively in the component groups forming the pair, and to operate simultaneously to place the components being picked up on the circuit board.

A program which allows a computer to function as a component placement setting calculation apparatus which generates component placement setting information for specifying sequencing for picking up and placing components by each of multiple placement heads, when the multiple placement heads operate simultaneously to pick up components from a pallet and operate simultaneously to place the components on a circuit board arranged in one direction with respect to the pallet, wherein,

• the program allows the computer to function as a control means to perform a processing, during one operation that the multiple placement heads pick up the components from the pallet and place the components on the circuit board, for specifying a pair of component groups to be simultaneously picked up from the pallet by the multiple placement heads so that an area where the multiple placement heads move in an overlapping manner is minimized, and
• a processing for generating the component placement setting information that allows each of the placement heads to operate simultaneously to pick up the components included respectively in the component groups forming the pair, and to operate simultaneously to place the components being picked up on the circuit board.

A component placement setting calculation method for allowing a component placement setting calculation apparatus to generate component placement setting information for specifying sequencing for picking up and placing components by each of multiple placement heads, when the multiple placement heads operate simultaneously to pick up components from a pallet and operate simultaneously to place the components on a circuit board arranged in one direction with respect to the pallet, wherein,

• the component placement setting calculation apparatus comprises a controller to perform a step, during one operation that the multiple placement heads pick up the components from the pallet and place the components on the circuit board, for specifying a pair of component groups to be simultaneously picked up from the pallet by the multiple placement heads so that an area where the multiple placement heads move in an overlapping manner is minimized, and
• a step for generating the component placement setting information that allows each of the placement heads to operate simultaneously to pick up the components included respectively in the component groups forming the pair, and to operate simultaneously to place the components being picked up on the circuit board.