Low temperature curing acrylate and maleimide based formulations and methods for use thereof
AssigneeDesigner Molecules, Inc.
InventorStephen M. Dershem
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Abstract
The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.
Claims51
An adhesive composition comprising an electron poor olefin, a nucleophile, and a base catalyst, wherein the composition cures by Michael addition at a temperature of about 50° C. to about 100° C.
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Dependencies are inferred from the claim text.