Manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsYuuki Kuro, Makoto Minaminaka
Life of this patent
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Abstract
A semiconductor chip which is mounted on a wiring substrate and which is electrically connected to the wiring substrate is disposed in a sealing apparatus. A sealing resin material made of a thermosetting resin composition is supplied into the sealing apparatus. The sealing resin material contains a solid foreign matter having a cured product of a thermosetting resin, and includes particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates. The semiconductor chip is resin sealed by using the sealing resin material.
Claims20
A manufacturing method of a semiconductor device, comprising:
- setting a sealing resin material, which is made of a thermosetting resin composition, containing a solid foreign matter having a cured product of the thermosetting resin composition in a sealing apparatus, the sealing resin material including particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates;
- setting a semiconductor chip mounted on a circuit substrate and electrically connecting to the circuit substrate in the sealing apparatus;
- and
- sealing the semiconductor chip by a cured product of the sealing resin material.
A manufacturing method of a semiconductor device comprising:
- setting a sealing resin material, which is made of a thermosetting resin composition, containing a solid foreign matter having a cured product of the thermosetting resin composition in a sealing apparatus for compression molding, the sealing resin material including particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates;
- setting a semiconductor chip mounted on a circuit substrate and electrically connecting to the circuit substrate in the sealing apparatus;
- heating and fluidizing the sealing resin material;
- pressurizing the fluidized sealing resin material while heating to cover the semiconductor chip by the fluidized sealing resin material;
- and
- thermosetting the sealing resin material to seal the semiconductor chip by a cured product of the sealing resin material.
Dependencies are inferred from the claim text.