Electronic module with a conductive-pattern layer and a method of manufacturing same
AssigneeImbera Electronics Oy
InventorsRisto TUOMINEN, Petteri Palm
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AssigneeImbera Electronics Oy
InventorsRisto TUOMINEN, Petteri Palm
Estimating the term…
This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
A method for manufacturing an electronic module, the method comprising:
A method for manufacturing an electronic module, the method comprising:
A method for manufacturing an electronic module, the method comprising:
Dependencies are inferred from the claim text.