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US 2010/0062565 A1Published application
Substrate Bonding with Bonding Material Having Rare Earth Metal
AssigneeAnalog Devices, Inc.
InventorsJohn R. Martin, Christine H. Tsau, Timothy J. Frey
Life of this patent
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Abstract
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
Claims30
A microchip comprising:
- a first substrate;
- a second substrate;
- and
- a bonding material bonding the first and second substrates, the bonding material comprising a rare earth metal and other material.
1 more element
A method of bonding a first substrate and a second substrate, the method comprising:
- forming at least one pedestal ring on the first substrate;
- disposing bonding material comprising a rare earth metal onto at least one of the pedestal ring and the second substrate;
- contacting the second substrate with the at least one pedestal ring on the first substrate, the bonding material being between the at least one pedestal ring and second substrate;
- and
- heating the bonding material to cause the bonding material to bond with at least one of the first substrate and the second substrate.
2 more elements
A method of bonding a MEMS wafer to a second wafer, the method comprising:
- providing the MEMS wafer with a two-dimensional array of MEMS devices;
- providing the second wafer;
- depositing a metal alloy onto one or both the MEMS wafer and the second wafer, the metal alloy comprising a rare earth metal;
- aligning the MEMS wafer and the second wafer;
- forming an intermediate apparatus having the metal alloy between the MEMS wafer and the second wafer;
- heating the intermediate apparatus at least to within 75 degrees C. of the melting point of the metal alloy between the MEMS wafer and the second wafer;
- and
- cooling the wafers to form a plurality of conductive hermetic sealing rings about the plurality of the MEMS devices on the MEMS wafer, the sealing rings bonding the MEMS wafer to the second wafer.
5 more elements
Dependencies are inferred from the claim text.