Die manufacturing method, functional film manufacturing method and functional film
AssigneeSony Corporation
InventorsHidehisa Murase, Yoshinari Sasaki, Kosei Aso, Tomohide Jozaki, Setsuo Okino
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Abstract
Disclosed herein is a die manufacturing method including the steps of: forming a pattern on the machining surface of a cylindrical resin original plate by laser machining; and fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.
Claims6
A die manufacturing method comprising the steps of:
- forming a pattern on the machining surface of a cylindrical resin original plate by laser machining;
- and
- fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.
A functional film manufacturing method comprising the step of
- transferring a pattern of a die obtained by a die manufacturing method onto a film base material by using the die, the die manufacturing method including the steps of
- forming a pattern on the machining surface of a cylindrical resin original plate by laser machining, and
- fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.
A functional film obtained by transferring a pattern of a die obtained by a die manufacturing method onto a film base material by using the die, the die manufacturing method comprising the steps of:
- forming a pattern on the machining surface of a cylindrical resin original plate by laser machining;
- and
- fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.
Dependencies are inferred from the claim text.