Polyimide film having smoothness on one surface
AssigneeUbe Industries, Ltd.
InventorsTakao Miyamoto, Hideki Iwai, Toshiyuki Nishino, Yasuhiro Nagoshi
Life of this patent
Estimating the term…
Loading patent…
AssigneeUbe Industries, Ltd.
InventorsTakao Miyamoto, Hideki Iwai, Toshiyuki Nishino, Yasuhiro Nagoshi
Estimating the term…
A polyimide film having one smooth surface favorably employable for a substrate of a display or an electronic paper is prepared by the steps of forming a laminated film by coating a polyimide precursor solution containing no filler, in which the polyimide is prepared from an acidic component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride and a diamine component comprising p-phenylene diamine, on one surface of a self-supporting film of a polyimide precursor solution containing a filler, in which the polyimide is prepared from an acidic component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride and a diamine component comprising p-phenylene diamine; and heating the laminated film to perform imidization.
A polyimide film having a thickness in the range of 20 to 150 μm which comprises a lower filler-containing polyimide resin layer comprising a polyimide resin prepared from an acidic component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride and a diamine component comprising p-phenylene diamine and a filler dispersed in the polyimide resin and an upper polyimide resin layer comprising a polyimide resin prepared from an acidic component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride and a diamine component comprising p-phenylene diamine formed continuously on the lower filler-containing polyimide resin layer, in which the polyimide film has a surface showing Ra of more than 1.0 nm but not more than 2.5 nm on the side of the filler-containing polyimide resin layer and a surface showing Ra of 1.0 nm or less on a reverse side.
Dependencies are inferred from the claim text.