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AssigneeEKRA AUTOMATISIERUNGSSYSTEME GmbH ASYS GROUP
InventorGeorg Baier
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The invention relates to a device and a method for processing flat substrates (2), such as circuit boards or the like to be printed, wherein the substrate (2) can be fed resting on a transport device on two opposite side edge regions (4), can be first lifted from below for the purpose of processing by means of supports (7) and pressed against corresponding hold-down pieces (10) in the side edge regions (4), and can be clamped on the corresponding side edges (11) of the substrate (2) in this position, resting on the supports (7), between two clamping strips (13), whereupon the hold-down piece (10) can be lowered to the side away from the substrate (2) and the clamping strip (13) and further below the region of the upper side (16) of the substrate (2) thus located, whereupon full-surface processing can take place.
A device for processing flat substrates such as circuit boards to be printed or the like, wherein the substrate may be supplied by two oppositely facing lateral edge areas while resting on a transport device, may be moved from the bottom upwards for the purpose of processing initially by means of supports and may be pushed against respective hold-downs in the lateral edge areas, may be clamped in this position resting on the supports along the corresponding lateral edges of the substrate between respective clamping bars, whereupon each hold-down may be lowered laterally away from the substrate and the respective clamping bar and further below the area of the top surface of the substrate thus disposed, whereupon a processing of the entire surface may be carried out.
A method for processing flat substrates such as for printing circuit boards or the like, wherein the substrate is supplied by means of a transport device by two oppositely facing lateral edge areas, is initially moved to a processing position from the bottom upwards in such a way that the lateral edge areas come to rest against the respective hold-downs, in which position subsequently respective clamping bars are brought to rest against the lateral edges of the substrate, which if necessary apply a clamping force, the hold-downs are then moved laterally away from the area of the substrate and the clamping bar and will then be lowered down below the area of the top surface of the substrate thus disposed, whereupon the processing is carried out.
Dependencies are inferred from the claim text.