Optoelectronic module form-factor adapter
AssigneeFinisar Corporation
InventorChristopher R. Cole
Life of this patent
Estimating the term…
Abstract
In one example embodiment, an adapter module includes a body having a first form-factor and multiple receptacles extending into the body. Each of the receptacles is configured to receive an optoelectronic module having a second form-factor. The second form-factor is smaller than the first form-factor. The first form-factor may substantially conform to the CFP MSA, for example. The second form-factor may substantially conform to the SFP+ or QSFP MSA, for example.
Claims20
An adapter module, comprising:
- a body configured to substantially conform to a first form-factor;
- and
- a plurality of receptacles extending into the body, the plurality of receptacles configured to receive optoelectronic modules that substantially conform to a second form factor that is smaller than the first form factor.
An adapter module configured to provide an interface between a host device port having a first form-factor and a plurality of optoelectronic modules having a second form-factor that is smaller than the first form-factor, comprising:
- a first connector configured to couple to a mating connector on a host device;
- a parallel transmit bus coupled to the first connector and configured to carry a first plurality of parallel data signals;
- a plurality of second connectors, each of the plurality of second connectors coupled to a different portion of the parallel transmit bus and configured to couple to a different one of a plurality of optoelectronic modules;
- and
- a parallel receive bus having a plurality of portions, each of the plurality of portions coupled to a different one of the plurality of second connectors, wherein the parallel receive bus is configured to transmit a second plurality of parallel data signals from the plurality of second connectors to the first connector.
An adapter module, comprising:
- a body configured to substantially conform to a first form-factor;
- a printed circuit board disposed within the body;
- a first connector connected to the printed circuit board and configured to couple to a mating connector on a host device, the host device including a receptacle configured to receive the body;
- a plurality of second connectors connected to the printed circuit board, each configured to couple to an optoelectronic module substantially conforming to a second form-factor;
- a parallel transmit bus coupled between the first connector and the plurality of second connectors and configured to carry a first plurality of parallel data signals from the first connector to the plurality of second connectors;
- and
- a receive parallel transmit bus coupled between the plurality of second connectors and the first connector and configured to carry a second plurality of parallel data signals from the plurality of second connectors to the first connector.
Dependencies are inferred from the claim text.