Back to results
US 2010/0059885 A1Published application
Integrated circuit package system with redistribution layer
AssigneeSTATS ChipPAC, Ltd.
InventorsHeap Hoe Kuan, Seng Guan Chow, Rui Huang
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
Claims20
An integrated circuit package system comprising:
- providing a base device;
- attaching a base interconnect to the base device;
- applying an encapsulant over the base device and the base interconnect;
- and
- forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
2 more elements
An integrated circuit package system comprising:
- providing a base device having a base front side and a base back side;
- attaching a base interconnect to the base front side and having a base ball-end near the base back side;
- applying an encapsulant over the base device and the base interconnect with the base back side and the base ball-end substantially exposed;
- forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate;
- and
- attaching a package connector over a side of the re-routing film opposite the base device.
3 more elements
An integrated circuit package system comprising:
- a base device;
- a base interconnect connected to the base device;
- an encapsulant over the base device and the base interconnect;
- and
- a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
2 more elements
Dependencies are inferred from the claim text.