Leadframe
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorSheng-Tsung Liu
Life of this patent
Estimating the term…
Abstract
A leadframe including a chip supporting plate, a lead forming plate, and solder points is provided. A notch is formed on an edge of the chip supporting plate. The thickness of the lead forming plate is less than the thickness of the chip supporting plate. The lead forming plate has a main body, inner leads, and a connecting rod. The inner leads and the connecting rod are extended from an edge of the main body. The connecting rod has an end portion fitting the notch. The solder points are located at the boundary between the end portion and the notch for structurally connecting the connecting rod and the chip supporting plate.
Claims20
A leadframe, comprising:
- a chip supporting plate, a notch being formed on an edge of the chip supporting plate;
- a lead forming plate, the thickness of the lead forming plate being less than the thickness of the chip supporting plate, the lead forming plate comprising a main body, a plurality of inner leads, and a connecting rod, wherein the inner leads and the connecting rod are extended from an edge of the main body, the connecting rod has an end portion fitting the notch, and the chip supporting plate and the lead forming plate are two individual components;
- and
- a plurality of solder points, located at the boundary between the end portion and the notch for structurally connecting the connecting rod and the chip supporting plate.
A leadframe, comprising:
- a chip supporting plate, a notch being formed on an edge of the chip supporting plate;
- and
- a lead forming plate, the lead forming plate and the chip supporting plate being two individual components, the thickness of the lead forming plate being less than the thickness of the chip supporting plate, the lead forming plate comprising a main body, a plurality of inner leads, and a connecting rod, wherein the inner leads and the connecting rod are extended from an edge of the main body, the connecting rod has an end portion fitting the notch, and the end portion is structurally connected to the notch of the chip supporting plate by laser welding.
Dependencies are inferred from the claim text.