Thinned semiconductor wafer and method of thinning a semiconductor wafer
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. Seddon
Life of this patent
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Abstract
A thinned semiconductor wafer and a method for thinning the semiconductor wafer. A semiconductor wafer is thinned from its backside to form a cavity in a central region of the backside of the semiconductor wafer. Forming the cavity also forms a ring support structure in a peripheral region of the semiconductor wafer. The ring support structure has an inner edge and an outer edge. The inner edge may be beveled or have a stepped shape.
Claims21
A method for thinning a semiconductor wafer, comprising:
- providing the semiconductor wafer having first and second sides and a major surface;
- and
- forming a ring support structure in the second side of the semiconductor wafer, wherein the ring support structure has first and second support portions and wherein a width of the second support portion is greater than a width of the first support portion.
A method for forming a ring support structure from a semiconductor wafer, comprising:
- providing the semiconductor wafer having first and second surfaces on first and second sides of the semiconductor wafer, respectively;
- removing a plurality of portions of the semiconductor wafer from the second side to form a cavity, wherein removing the plurality of portions comprises:
- removing a first portion of the semiconductor wafer from the second side to form a first portion of the cavity, the first portion of the cavity having a first dimension;
- and
- removing a second portion of the semiconductor wafer from the second side to form a second portion of the cavity, the second portion of the cavity having a second dimension, the second dimension greater than the first dimension.
A semiconductor wafer having a ring support structure, wherein the ring support structure comprises a rim having at least first and second portions, wherein the first portion has a first width and the second portion has a second width, the second width greater than the first width.
Dependencies are inferred from the claim text.