Matrix electronic devices using opaque substrates and fabrication method therefor
AssigneeSilk Displays
InventorsMark Andrews, Bell Fong
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Abstract
A fabrication method is described for forming an electronic circuit on a flexible substrate consisting of plastic and opaque foils. Corresponding circuit structures are also described herein. The opaque substrate can be selected from a set of polymers which have the appropriate thermo-mechanical properties. The foil geometry of the opaque substrate can be selected to maximize the structural integrity on the display in the planar directions but have excellent mechanical stress distribution when bent or flexed.
Claims38
A method of forming a flexible matrix of electronic devices comprising:
- providing a flexible metal substrate;
- forming an electrical insulation layer on the flexible metal substrate;
- forming an array of electronic devices on the electrical insulation layer;
- attaching the flexible metal substrate, including the array of electronic devices and the electrical insulation layer, to a flexible plastic substrate;
- and
- forming a desired pattern on the flexible metal substrate.
A flexible matrix of electronic devices comprising:
- a flexible plastic substrate;
- a flexible metal substrate secured to the flexible plastic substrate;
- an electrical insulation layer provided on the flexible metal substrate;
- a desired pattern being formed on both the electrical insulation layer and the flexible metal substrate;
- and
- an electronic array provided on the insulation layer.
Dependencies are inferred from the claim text.